Table 4 Exploration of mounted substrate boards heat source varieties

Shankar et al. [61]

3 × 5 aluminum HSs

The numerical results demonstrated a drop in Reynolds number and HSs surface temperature, as well as an increase in thermal conductivity.

Because the current study solely takes into account that specific arrangement, there were few applications offered.

Shankar et al. [62]

9 aluminum square parts

The results showed that the temperature excess values achieved for FR4 and bakelite were high when compared to the copper-clad board.

Correlations were not very useful.

Kia et al. [63]

15 protruding aluminum square HSs

The single-side copper clad was selected, according to experiment results, and simulations showed a variation of less than 5%.

High-temperature applications are constrained.

Naveen et al. [64]

15 aluminum discrete square HSs of 15,155 mm sizes

An analysis revealed that a single-layer copper-clad substrate board could effectively dissipate heat from electronic components for the heat flux values (4000 to 12,000 W/m²)

The single-layer copper-clad board was an inappropriate selection for the substrate board.