Table 3 Types of convection for thermal management on electronic devices

Peng et al. [51]

Forced air convection

Analysis showed that the maximum temperature on force air convection for the active mode significantly decreased as compared to the passive mode.

With only 4 mm gaps, the analysis’s requirements could not be met.

S. Sadrabadi, et al. [52]

Natural convection

According to the results, the plate cubic PFHS had a thermal resistance that was around 12% lower than the plate pin-fin.

If the various types of micro-channel impacts with varied rib forms have been studied, the performance will be improved.

Shahrouz et al. [53]

Mixed convection

The investigation showed that when the nanoparticle volume percentage increased, the Reynolds number, temperature gradients, and heat absorption all decreased in the cavity.

In some cases, mixed convection resulted in limited enhancement of HT.

Masoud et al. [54]

Mixed convection

The results showed that the silicon chip and cavity had the best HT when approached from angles of (− 45°, 0°, − 90°, 45°, and 90°)

HT was not directly feasible for some geometries, such as cavities. The HT process requires optimization.

Youfu et al. [55]

Forced air convection

According to analysis, serpentine PCM (S-PCM) increases energy density while consuming just 70% of the energy.

The considerable temperature gradient during analysis could cause issues.

Purusothaman et al. [56]

Natural convection

The results showed that the applied correlations improved the parameters of EDs and produced excellent results with 100% dependability.

Due to the larger volume fraction of nanoparticles, the HT rate will be constrained.

Fatih et al. [57]

Mixed convection

Analysis revealed that when a larger cylinder was used in contrast to a smaller one for the cylinder’s clockwise rotation, the average Nusselt number increased by 10%.

In some cases, the process was slow.